EVLV 30 II UC STEREO Laser Intel® H470 Chipset

Intel® H470 Chipset

50 kg Mount Type Rack-mountable Rack Height 2U Height 89 mm Width 445 mm Depth 114 mm Power Description Input Voltage 230 V AC Output Voltage 230 V AC Input Current 32 A Technical Information Plug/Connector Type IEC 60309 (2P+E) 32A Receptacle Type IEC 60320 C13 PDU Type Switched Receptacle Detail 16 x IEC 60320 C13 Plug/Connector Detail 1 x IEC 60309 (2P+E) 32A

3 cm (19")

2 Features Display Stream Compression (DSC) Features Flexible Features Forward Error Correction (FEC) Support Cable Type DisplayPort Connector Type on First End DisplayPort 1

Interfaces/Ports Modular No Total Number of Network Ports 5 Port/Expansion Slot Details 5 x Gigabit Ethernet Network Management & Protocols Manageable No Media & Performance Network Technology 10/100/1000Base-T Ethernet Technology Gigabit Ethernet Media Type Supported Twisted Pair Miscellaneous Environmentally Friendly Yes Network & Communication Layer Supported 2 Physical Characteristics Weight (Approximate) 230 g Form Factor Desktop Form Factor Rack-mountable Form Factor Wall Mountable Height 30 mm Width 110 mm Depth 75 mm Power Description Power Source Power Adapter Power Consumption 2

EVLV 30 II UC STEREO Laser Intel® H470 ChipsetEarpiece Earpiece Design Over the head Earpiece Type Binaural Interfaces Ports Host Interface Mini phone (3. 5mm) Microphone Microphone Design Boom Physical Characteristics Form Factor Supra aural Technical Information Sound Mode Stereo Connectivity Technology Wired Features Comfortable Features Digital Signal Processing (DSP) Features Passive Noise Cancellation Features Unified Communication Noise Canceling Yes