MJ BGA Reballing Solder Stencil Plant Tin Net For Samsung C7010/J610 general C7/J3/J5/A5 series and other MSM8916/MSM8953 B01-AB CPU general series Connector flex Comfortable large area platform150mm Height
Pay in 4 interest-free payments of $5.36 Learn more
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 8 - Aug 13
Live Spec
MJ BGA Reballing Solder Stencil Plant Tin Net For Samsung C7010/J610 general C7/J3/J5/A5 series and other MSM8916/MSM8953 B01-AB CPU general series Connector flex Comfortable large area platform150mm HeightPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.
Store: www.ab-travaux.com · Domain: www.ab-travaux.com
