Hydra-LF-305 T3-T6 - Sn96.5.Ag3.Cu0.5 ultra-low voiding lead-free water-soluble solder paste 3% silver SAC305 (REL0) F Low mid-chip bidding

Low mid-chip bidding

HT-AG5 - Sn95Ag5 high-temp lead-free solder wire NC-core ROL0 - 100g spool

Medium activity with QC-tracer effectively addressing BGA slumping issues

manufacturers can minimize BGA solder sphere slumping and improve the reliability of their electronic products

QC-Aid - Everyone Can QC

Hydra-LF-305 T3-T6 - Sn96.5.Ag3.Cu0.5 ultra-low voiding lead-free water-soluble solder paste 3% silver SAC305 (REL0) F Low mid-chip biddingHydra LF 305 Sn96. 5. Ag3. Cu0. 5 SAC305 lead free water soluble ultra low voiding REL0 solder paste 3% Silver with QC Aid optical tracer for instant visual QC IPC Designation REL0 (cleaned) Lead free BGA, CSP, QFN, LGA Low voiding. Low mid chip bidding. Clear residue. Long stencil life. Rolling well on the blade Sharp printing definition at high speeds Instant wetting on most PCB finishes Easy to clean using warm DI water, IPA, solvents, water based